Products Information：
Extremely short cycle time with rotary table design. Product loading and unloading can be done during the heat sealing process
High quality heat seal application up to 0.25mm pitch
Pneumatic bonding head provide up to 3,900N force
Digital programmable pressure control with LCD display
Closed loop PID temperature control with visible LED display
Bonding cycle is triggered by a real time pressure sensor
Floating Thermode ensure consistent pressure and heat transfer along the flexfoil to LCD and/or PCB
Precision product fixtures (2X), easy exchange, provided with micrometer alignment and vacuum to fix components
Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch application
Full microprocessor logic control
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?hotbar machine ?Hotbar Bonding Machine ??Hot Bar Sealing Machine
?Hot Bar Soldering machine ?Hot bar Heat sealing
?FPC welding machine ?FFC hotbar machine Pulse Heating Machine
?Pulse Heat Bonding Machine Hot-pressing Machine Heat Bonder
?TAB Bonder Heat Seal Machines ?Pulse bonding Machine
